SMT pinna kinnituse tehnoloogia protsess

Ühepoolne kokkupanek
Incoming material inspection => Silk screen solder paste (sMD glue) => SMD => Drying (curing) => Reflow soldering => Cleaning => Inspection =>Ümbertöötamine
Kahepoolne kokkupanek
A: Incoming material inspection => Silk screen solder paste (sMD glue) on PCB A side => SMD PCB Silk screen solder paste (sMD glue) on PCB B side => SMD => Drying => Reflow soldering (preferably only on B side => Cleaning => Inspection =>Ümber töö).
B: Incoming material inspection => Silk screen solder paste (sMD glue) on PCB A side => SMD => Drying (curing) => Reflow soldering on A side => Cleaning => Flip board => SMD glue on PCB B side => SMD => Curing => Wave soldering on B side => Cleaning => Inspection =>Ümbertöötamine)
See protsess sobib PCB jootmiseks PCB -ga jootmiseks ja laine jootmiseks B küljel. See protsess sobib SMD -de jaoks, mis on kokku pandud PCB B küljele, kui seal on ainult SOT või SOT (28) tihvtid või vähem.
Ühepoolsed segakomplektiprotsess
Incoming material inspection => Screen printing solder paste on the A side of the PCB (applying SMD glue) => SMD => Drying (curing) => Reflow soldering => Cleaning => Plug-in => Wave soldering => Cleaning => Inspection =>Ümbertöötamine
Kahepoolne segakomplektiprotsess
A: Incoming material inspection => Apply SMD glue on the B side of the PCB => SMD => Curing => Flip board => Plug-in on the A side of the PCB => Wave soldering => Cleaning => Inspection =>Ümbertöötamine
Kandke kõigepealt ja seejärel sisestage, mis sobib olukorra jaoks, kus SMD -komponente on rohkem kui diskreetseid komponente.
B: Incoming material inspection => Plug-in on the A side of the PCB (pin bending) => Flip board => Apply SMD glue on the B side of the PCB => SMD => Curing => Flip board => Wave soldering => Cleaning => Inspection =>Ümbertöötamine
Sisestage kõigepealt ja rakendage seejärel, mis sobib olukorra jaoks, kus diskreetseid komponente on rohkem kui SMD komponendid.
C: Incoming material inspection => PCB A side screen printing solder paste => SMD => Drying => Reflow soldering => Plug-in, pin bending => Flip board => PCB B side SMD glue => SMD => Curing => Flip board => Wave soldering => Cleaning => Inspection =>Korrake külje segatud komplekt, B külg SMD.
D: Incoming material inspection => PCB B side SMD glue => SMD => Curing => Flip board => PCB A side screen printing solder paste => SMD => Reflow soldering => Plug-in => Wave soldering => Cleaning => Inspection => Rework A side mixed assembly, B side SMD. First paste SMD on both sides, reflow soldering, then plug-in, wave soldering E: Incoming material inspection => Silk screen solder paste (smear patch glue) on the B side of the PCB => Smear => Drying (curing) => Reflow soldering => Flip board => Silk screen solder paste on the A side of the PCB => Smear => Drying = Reflow soldering 1 (local soldering can be used) => Plug-in => Wave soldering 2 (if there are few plug-in components, manual soldering can be used) => Cleaning => Inspection =>Korrake külje kinnitus, b külg segatud kinnitus.
Kahepoolse kokkupanekuprotsess
V: Sissetulev materjalikontroll, siidise ekraaniga joodiskraadi (määrdeplaastri liim) PCB küljel, määrdumine, kuivatamine (kõvendamine), külgjoonistus jootmine, puhastamine, klapplaud; Siidiekraaniga joodisepasta (määrdeplaastri liim) PCB B küljel, määrdumine, kuivatamine, jootmise jootmine (eelistatavalt ainult B -külje jaoks, puhastamine, ülevaatus, ümbertöötamine)
See protsess sobib suurte SMD -de, näiteks PLCC paigaldamiseks PCB mõlemal küljel.
B: sissetulev materjalikontroll, ekraanitrüki joodepasta PCB küljele (SMD -liimi rakendamine), SMD, kuivatamine (kõvendamine), jootmist A küljele, puhastamine ja libistamine; SMD -liimi rakendamine PCB küljele, SMD, kõvenemine, laine jootmine küljele B, puhastamine, kontrollimine ja ümbertöötamine) See protsess sobib PCB küljelt A küljelt tagamiseks.